Determination of Copper concentration in Ruthenium electroplating baths
Copper analysis allows the quantification of Cu2+ concentration in ruthenium electroplating baths. Copper can contaminate ruthenium baths causing issues of aesthetic and functional defects in finished products (e.g. pitting, flaking, pitting corrosion). Monitoring the concentration of copper in ruthenium baths is essential as part of the quality control of galvanic processes to ensure their efficiency and meet the high quality standards required by the market.
Method
Test type: End Point.
Testing time: 2 minutes.
Analysis sessions with multiple samples are possible up to a maximum of 16 tests for CDR GalvanLab® and 3 tests for CDR GalvanLab® Junior.
Sample treatment
The sample can be used as is.
Principle of the test
Copper content is determined by its reaction with a chromogen that develops a coloration, the optical intensity of which is proportional to the concentration of Cu in the analyzed sample.
Calibration curve
Calibration curve was obtained by correlating the CDR method with the reference method.
Reagent test Kits
Measuring range
| Analyses | Measuring range | Resolution | Repeatability |
|---|---|---|---|
| Copper on Ru bath | 3 - 25 mg/L | 0.100 mg/L | 0.6 mg/L |
The chemical analysis instruments for electroplating baths
CDR GalvanLab®
- Complete analysis panel, supplied already configured
- Up to 16 determinations simultaneously
- Possibility of carrying out analyses of the same sample
- Integrated printer
- Full connections (LAN - USB - Bluetooth barcode/QR code reader)
CDR GalvanLab® Jr
- Partial analysis panel, customisable configuration
- Up to 3 determinations simultaneously
- Wireless connection to external printer
- USB connections
